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Microchip Technology |
IC EEPROM 256K PARALLEL 28SOIC |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 90ns | Parallel | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
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Microchip Technology |
IC EEPROM 256K PARALLEL 32PLCC |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 70ns | Parallel | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
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Microchip Technology |
IC EEPROM 64K SPI 10MHZ 8SOIC |
Active | Non-Volatile | EEPROM | EEPROM | 64Kb (8K x 8) | 10MHz | 5ms | - | SPI | 2.5 V ~ 5.5 V | -55°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
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Microchip Technology |
IC EEPROM 512K SPI 20MHZ 8SOIC |
Active | Non-Volatile | EEPROM | EEPROM | 512Kb (64K x 8) | 20MHz | 5ms | - | SPI | 2.5 V ~ 5.5 V | -55°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
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Microchip Technology |
IC EEPROM 256K SPI 10MHZ 8DFN |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | 10MHz | 5ms | - | SPI | 2.5 V ~ 5.5 V | -55°C ~ 125°C (TA) | Surface Mount | 8-VDFN Exposed Pad | 8-DFN-S (6x5) |
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Microchip Technology |
IC EEPROM 256K PARALLEL 32PLCC |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 3ms | 120ns | Parallel | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
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Microchip Technology |
IC EEPROM 1M PARALLEL 32TSOP |
Active | Non-Volatile | EEPROM | EEPROM | 1Mb (128K x 8) | - | 10ms | 150ns | Parallel | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
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Microchip Technology |
IC EEPROM 256K PARALLEL 32LCC |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 200ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-LCC (11.43x13.97) |
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Microchip Technology |
IC EEPROM 256K PARALLEL 32LCC |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 250ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-LCC (11.43x13.97) |
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Microchip Technology |
IC EEPROM 256K PARALLEL 32CLCC |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 200ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | - | - | - |
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Microchip Technology |
IC EEPROM 256K PARALLEL 32CLCC |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 250ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | - | - | - |
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Microchip Technology |
IC EEPROM 256K PARALLEL 32CLCC |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 250ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | - | - | - |
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Microchip Technology |
IC EEPROM 256K PARALLEL 32CLCC |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 150ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | - | - | - |
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Microchip Technology |
IC EEPROM 256K PARALLEL 28FLATPK |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 200ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
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Microchip Technology |
IC EEPROM 256K PARALLEL 28FLATPK |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 200ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
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Microchip Technology |
IC EEPROM 256K PARALLEL 32LCC |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 200ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-LCC (11.43x13.97) |
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Microchip Technology |
IC EEPROM 256K PARALLEL 32LCC |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 250ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-LCC (11.43x13.97) |
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Microchip Technology |
IC EEPROM 256K PARALLEL 32LCC |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 120ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-LCC (11.43x13.97) |
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Microchip Technology |
IC EEPROM 256K PARALLEL 32CLCC |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 250ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | - | - | - |
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Microchip Technology |
IC EEPROM 256K PARALLEL 32LCC |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 150ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-LCC (11.43x13.97) |
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Microchip Technology |
IC EEPROM 256K PARALLEL 32CLCC |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 150ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | - | - | - |
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Microchip Technology |
IC EEPROM 256K PARALLEL 32LCC |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 3ms | 150ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-LCC (11.43x13.97) |
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Microchip Technology |
IC EEPROM 256K PARALLEL 32CLCC |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 3ms | 150ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | - | - | - |
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Microchip Technology |
IC EEPROM 256K PARALLEL 32LCC |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 90ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-LCC (11.43x13.97) |
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Microchip Technology |
IC EEPROM 256K PARALLEL 32CLCC |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 90ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | - | - | - |
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Microchip Technology |
IC EEPROM 256K PARALLEL 28FLATPK |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 150ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
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Microchip Technology |
IC EEPROM 256K PARALLEL 28FLATPK |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 250ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
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Microchip Technology |
IC EEPROM 256K PARALLEL 28FLATPK |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 250ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
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Microchip Technology |
IC EEPROM 256K PARALLEL 28FLATPK |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 150ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
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Microchip Technology |
IC EEPROM 256K PARALLEL 28FLATPK |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 250ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
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Microchip Technology |
IC EEPROM 256K PARALLEL 28FLATPK |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 250ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
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Microchip Technology |
IC EEPROM 256K PARALLEL 28FLATPK |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 150ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
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Microchip Technology |
IC EEPROM 256K PARALLEL 28FLATPK |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 200ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
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Microchip Technology |
IC EEPROM 256K PARALLEL 28FLATPK |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 3ms | 150ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
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Microchip Technology |
IC EEPROM 256K PARALLEL 28FLATPK |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 120ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
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Microchip Technology |
IC EEPROM 256K PARALLEL 28FLATPK |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 150ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
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Microchip Technology |
IC EEPROM 256K PARALLEL 32LCC |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 120ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-LCC (11.43x13.97) |
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Microchip Technology |
IC EEPROM 256K PARALLEL 32LCC |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 3ms | 120ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-LCC (11.43x13.97) |
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Microchip Technology |
IC EEPROM 256K PARALLEL 32LCC |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 90ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-LCC (11.43x13.97) |
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Microchip Technology |
IC EEPROM 256K PARALLEL 28FLATPK |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 90ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
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Microchip Technology |
IC EEPROM 256K PARALLEL 28FLATPK |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 90ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
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Microchip Technology |
IC EEPROM 256K PARALLEL 32LCC |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 3ms | 90ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-LCC (11.43x13.97) |
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Microchip Technology |
IC EEPROM 256K PARALLEL 28FLATPK |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 120ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
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Microchip Technology |
IC EEPROM 256K PARALLEL 28FLATPK |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 3ms | 120ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
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Microchip Technology |
IC EEPROM 256K PARALLEL 28FLATPK |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 90ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
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Microchip Technology |
IC EEPROM 256K PARALLEL 28FLATPK |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 3ms | 90ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
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Microchip Technology |
IC EEPROM 256K PARALLEL 28CPGA |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 150ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | - | - | - |
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Microchip Technology |
IC EEPROM 256K PARALLEL 28CDIP |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 200ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 28-CDIP (0.600", 15.24mm) | 28-CDIP |
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Microchip Technology |
IC EEPROM 256K PARALLEL 28CDIP |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 150ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 28-CDIP (0.600", 15.24mm) | 28-CDIP |
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Microchip Technology |
IC EEPROM 256K PARALLEL 28CDIP |
Active | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | - | 10ms | 200ns | Parallel | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 28-CDIP (0.600", 15.24mm) | 28-CDIP |