Part Number Manufacturer / Brand Brife Description Part StatusMemory TypeMemory FormatTechnologyMemory SizeClock FrequencyWrite Cycle Time - Word, PageAccess TimeMemory InterfaceVoltage - SupplyOperating TemperatureMounting TypePackage / CaseSupplier Device Package
Microchip Technology IC EEPROM 256K PARALLEL 28SOIC ActiveNon-VolatileEEPROMEEPROM256Kb (32K x 8)
-
10ms90nsParallel4.5 V ~ 5.5 V-40°C ~ 85°C (TC)Surface Mount28-SOIC (0.295", 7.50mm Width)28-SOIC
Microchip Technology IC EEPROM 256K PARALLEL 32PLCC ActiveNon-VolatileEEPROMEEPROM256Kb (32K x 8)
-
10ms70nsParallel4.5 V ~ 5.5 V-40°C ~ 85°C (TC)Surface Mount32-LCC (J-Lead)32-PLCC (11.43x13.97)
Microchip Technology IC EEPROM 64K SPI 10MHZ 8SOIC ActiveNon-VolatileEEPROMEEPROM64Kb (8K x 8)10MHz5ms
-
SPI2.5 V ~ 5.5 V-55°C ~ 125°C (TA)Surface Mount8-SOIC (0.154", 3.90mm Width)8-SOIC
Microchip Technology IC EEPROM 512K SPI 20MHZ 8SOIC ActiveNon-VolatileEEPROMEEPROM512Kb (64K x 8)20MHz5ms
-
SPI2.5 V ~ 5.5 V-55°C ~ 125°C (TA)Surface Mount8-SOIC (0.154", 3.90mm Width)8-SOIC
Microchip Technology IC EEPROM 256K SPI 10MHZ 8DFN ActiveNon-VolatileEEPROMEEPROM256Kb (32K x 8)10MHz5ms
-
SPI2.5 V ~ 5.5 V-55°C ~ 125°C (TA)Surface Mount8-VDFN Exposed Pad8-DFN-S (6x5)
Microchip Technology IC EEPROM 256K PARALLEL 32PLCC ActiveNon-VolatileEEPROMEEPROM256Kb (32K x 8)
-
3ms120nsParallel4.5 V ~ 5.5 V0°C ~ 70°C (TC)Surface Mount32-LCC (J-Lead)32-PLCC
Microchip Technology IC EEPROM 1M PARALLEL 32TSOP ActiveNon-VolatileEEPROMEEPROM1Mb (128K x 8)
-
10ms150nsParallel4.5 V ~ 5.5 V-40°C ~ 85°C (TC)Surface Mount32-TFSOP (0.724", 18.40mm Width)32-TSOP
Microchip Technology IC EEPROM 256K PARALLEL 32LCC ActiveNon-VolatileEEPROMEEPROM256Kb (32K x 8)
-
10ms200nsParallel4.5 V ~ 5.5 V-55°C ~ 125°C (TC)Surface Mount32-CLCC32-LCC (11.43x13.97)
Microchip Technology IC EEPROM 256K PARALLEL 32LCC ActiveNon-VolatileEEPROMEEPROM256Kb (32K x 8)
-
10ms250nsParallel4.5 V ~ 5.5 V-55°C ~ 125°C (TC)Surface Mount32-CLCC32-LCC (11.43x13.97)
Microchip Technology IC EEPROM 256K PARALLEL 32CLCC ActiveNon-VolatileEEPROMEEPROM256Kb (32K x 8)
-
10ms200nsParallel4.5 V ~ 5.5 V-55°C ~ 125°C (TC)
-
-
-
Microchip Technology IC EEPROM 256K PARALLEL 32CLCC ActiveNon-VolatileEEPROMEEPROM256Kb (32K x 8)
-
10ms250nsParallel4.5 V ~ 5.5 V-55°C ~ 125°C (TC)
-
-
-
Microchip Technology IC EEPROM 256K PARALLEL 32CLCC ActiveNon-VolatileEEPROMEEPROM256Kb (32K x 8)
-
10ms250nsParallel4.5 V ~ 5.5 V-55°C ~ 125°C (TC)
-
-
-
Microchip Technology IC EEPROM 256K PARALLEL 32CLCC ActiveNon-VolatileEEPROMEEPROM256Kb (32K x 8)
-
10ms150nsParallel4.5 V ~ 5.5 V-55°C ~ 125°C (TC)
-
-
-
Microchip Technology IC EEPROM 256K PARALLEL 28FLATPK ActiveNon-VolatileEEPROMEEPROM256Kb (32K x 8)
-
10ms200nsParallel4.5 V ~ 5.5 V-55°C ~ 125°C (TC)Surface Mount28-CFlatPack28-Flatpack, Ceramic Bottom-Brazed
Microchip Technology IC EEPROM 256K PARALLEL 28FLATPK ActiveNon-VolatileEEPROMEEPROM256Kb (32K x 8)
-
10ms200nsParallel4.5 V ~ 5.5 V-55°C ~ 125°C (TC)Surface Mount28-CFlatPack28-Flatpack, Ceramic Bottom-Brazed
Microchip Technology IC EEPROM 256K PARALLEL 32LCC ActiveNon-VolatileEEPROMEEPROM256Kb (32K x 8)
-
10ms200nsParallel4.5 V ~ 5.5 V-55°C ~ 125°C (TC)Surface Mount32-CLCC32-LCC (11.43x13.97)
Microchip Technology IC EEPROM 256K PARALLEL 32LCC ActiveNon-VolatileEEPROMEEPROM256Kb (32K x 8)
-
10ms250nsParallel4.5 V ~ 5.5 V-55°C ~ 125°C (TC)Surface Mount32-CLCC32-LCC (11.43x13.97)
Microchip Technology IC EEPROM 256K PARALLEL 32LCC ActiveNon-VolatileEEPROMEEPROM256Kb (32K x 8)
-
10ms120nsParallel4.5 V ~ 5.5 V-55°C ~ 125°C (TC)Surface Mount32-CLCC32-LCC (11.43x13.97)
Microchip Technology IC EEPROM 256K PARALLEL 32CLCC ActiveNon-VolatileEEPROMEEPROM256Kb (32K x 8)
-
10ms250nsParallel4.5 V ~ 5.5 V-55°C ~ 125°C (TC)
-
-
-
Microchip Technology IC EEPROM 256K PARALLEL 32LCC ActiveNon-VolatileEEPROMEEPROM256Kb (32K x 8)
-
10ms150nsParallel4.5 V ~ 5.5 V-55°C ~ 125°C (TC)Surface Mount32-CLCC32-LCC (11.43x13.97)
Microchip Technology IC EEPROM 256K PARALLEL 32CLCC ActiveNon-VolatileEEPROMEEPROM256Kb (32K x 8)
-
10ms150nsParallel4.5 V ~ 5.5 V-55°C ~ 125°C (TC)
-
-
-
Microchip Technology IC EEPROM 256K PARALLEL 32LCC ActiveNon-VolatileEEPROMEEPROM256Kb (32K x 8)
-
3ms150nsParallel4.5 V ~ 5.5 V-55°C ~ 125°C (TC)Surface Mount32-CLCC32-LCC (11.43x13.97)
Microchip Technology IC EEPROM 256K PARALLEL 32CLCC ActiveNon-VolatileEEPROMEEPROM256Kb (32K x 8)
-
3ms150nsParallel4.5 V ~ 5.5 V-55°C ~ 125°C (TC)
-
-
-
Microchip Technology IC EEPROM 256K PARALLEL 32LCC ActiveNon-VolatileEEPROMEEPROM256Kb (32K x 8)
-
10ms90nsParallel4.5 V ~ 5.5 V-55°C ~ 125°C (TC)Surface Mount32-CLCC32-LCC (11.43x13.97)
Microchip Technology IC EEPROM 256K PARALLEL 32CLCC ActiveNon-VolatileEEPROMEEPROM256Kb (32K x 8)
-
10ms90nsParallel4.5 V ~ 5.5 V-55°C ~ 125°C (TC)
-
-
-
Microchip Technology IC EEPROM 256K PARALLEL 28FLATPK ActiveNon-VolatileEEPROMEEPROM256Kb (32K x 8)
-
10ms150nsParallel4.5 V ~ 5.5 V-55°C ~ 125°C (TC)Surface Mount28-CFlatPack28-Flatpack, Ceramic Bottom-Brazed
Microchip Technology IC EEPROM 256K PARALLEL 28FLATPK ActiveNon-VolatileEEPROMEEPROM256Kb (32K x 8)
-
10ms250nsParallel4.5 V ~ 5.5 V-55°C ~ 125°C (TC)Surface Mount28-CFlatPack28-Flatpack, Ceramic Bottom-Brazed
Microchip Technology IC EEPROM 256K PARALLEL 28FLATPK ActiveNon-VolatileEEPROMEEPROM256Kb (32K x 8)
-
10ms250nsParallel4.5 V ~ 5.5 V-55°C ~ 125°C (TC)Surface Mount28-CFlatPack28-Flatpack, Ceramic Bottom-Brazed
Microchip Technology IC EEPROM 256K PARALLEL 28FLATPK ActiveNon-VolatileEEPROMEEPROM256Kb (32K x 8)
-
10ms150nsParallel4.5 V ~ 5.5 V-55°C ~ 125°C (TC)Surface Mount28-CFlatPack28-Flatpack, Ceramic Bottom-Brazed
Microchip Technology IC EEPROM 256K PARALLEL 28FLATPK ActiveNon-VolatileEEPROMEEPROM256Kb (32K x 8)
-
10ms250nsParallel4.5 V ~ 5.5 V-55°C ~ 125°C (TC)Surface Mount28-CFlatPack28-Flatpack, Ceramic Bottom-Brazed
Microchip Technology IC EEPROM 256K PARALLEL 28FLATPK ActiveNon-VolatileEEPROMEEPROM256Kb (32K x 8)
-
10ms250nsParallel4.5 V ~ 5.5 V-55°C ~ 125°C (TC)Surface Mount28-CFlatPack28-Flatpack, Ceramic Bottom-Brazed
Microchip Technology IC EEPROM 256K PARALLEL 28FLATPK ActiveNon-VolatileEEPROMEEPROM256Kb (32K x 8)
-
10ms150nsParallel4.5 V ~ 5.5 V-55°C ~ 125°C (TC)Surface Mount28-CFlatPack28-Flatpack, Ceramic Bottom-Brazed
Microchip Technology IC EEPROM 256K PARALLEL 28FLATPK ActiveNon-VolatileEEPROMEEPROM256Kb (32K x 8)
-
10ms200nsParallel4.5 V ~ 5.5 V-55°C ~ 125°C (TC)Surface Mount28-CFlatPack28-Flatpack, Ceramic Bottom-Brazed
Microchip Technology IC EEPROM 256K PARALLEL 28FLATPK ActiveNon-VolatileEEPROMEEPROM256Kb (32K x 8)
-
3ms150nsParallel4.5 V ~ 5.5 V-55°C ~ 125°C (TC)Surface Mount28-CFlatPack28-Flatpack, Ceramic Bottom-Brazed
Microchip Technology IC EEPROM 256K PARALLEL 28FLATPK ActiveNon-VolatileEEPROMEEPROM256Kb (32K x 8)
-
10ms120nsParallel4.5 V ~ 5.5 V-55°C ~ 125°C (TC)Surface Mount28-CFlatPack28-Flatpack, Ceramic Bottom-Brazed
Microchip Technology IC EEPROM 256K PARALLEL 28FLATPK ActiveNon-VolatileEEPROMEEPROM256Kb (32K x 8)
-
10ms150nsParallel4.5 V ~ 5.5 V-55°C ~ 125°C (TC)Surface Mount28-CFlatPack28-Flatpack, Ceramic Bottom-Brazed
Microchip Technology IC EEPROM 256K PARALLEL 32LCC ActiveNon-VolatileEEPROMEEPROM256Kb (32K x 8)
-
10ms120nsParallel4.5 V ~ 5.5 V-55°C ~ 125°C (TC)Surface Mount32-CLCC32-LCC (11.43x13.97)
Microchip Technology IC EEPROM 256K PARALLEL 32LCC ActiveNon-VolatileEEPROMEEPROM256Kb (32K x 8)
-
3ms120nsParallel4.5 V ~ 5.5 V-55°C ~ 125°C (TC)Surface Mount32-CLCC32-LCC (11.43x13.97)
Microchip Technology IC EEPROM 256K PARALLEL 32LCC ActiveNon-VolatileEEPROMEEPROM256Kb (32K x 8)
-
10ms90nsParallel4.5 V ~ 5.5 V-55°C ~ 125°C (TC)Surface Mount32-CLCC32-LCC (11.43x13.97)
Microchip Technology IC EEPROM 256K PARALLEL 28FLATPK ActiveNon-VolatileEEPROMEEPROM256Kb (32K x 8)
-
10ms90nsParallel4.5 V ~ 5.5 V-55°C ~ 125°C (TC)Surface Mount28-CFlatPack28-Flatpack, Ceramic Bottom-Brazed
Microchip Technology IC EEPROM 256K PARALLEL 28FLATPK ActiveNon-VolatileEEPROMEEPROM256Kb (32K x 8)
-
10ms90nsParallel4.5 V ~ 5.5 V-55°C ~ 125°C (TC)Surface Mount28-CFlatPack28-Flatpack, Ceramic Bottom-Brazed
Microchip Technology IC EEPROM 256K PARALLEL 32LCC ActiveNon-VolatileEEPROMEEPROM256Kb (32K x 8)
-
3ms90nsParallel4.5 V ~ 5.5 V-55°C ~ 125°C (TC)Surface Mount32-CLCC32-LCC (11.43x13.97)
Microchip Technology IC EEPROM 256K PARALLEL 28FLATPK ActiveNon-VolatileEEPROMEEPROM256Kb (32K x 8)
-
10ms120nsParallel4.5 V ~ 5.5 V-55°C ~ 125°C (TC)Surface Mount28-CFlatPack28-Flatpack, Ceramic Bottom-Brazed
Microchip Technology IC EEPROM 256K PARALLEL 28FLATPK ActiveNon-VolatileEEPROMEEPROM256Kb (32K x 8)
-
3ms120nsParallel4.5 V ~ 5.5 V-55°C ~ 125°C (TC)Surface Mount28-CFlatPack28-Flatpack, Ceramic Bottom-Brazed
Microchip Technology IC EEPROM 256K PARALLEL 28FLATPK ActiveNon-VolatileEEPROMEEPROM256Kb (32K x 8)
-
10ms90nsParallel4.5 V ~ 5.5 V-55°C ~ 125°C (TC)Surface Mount28-CFlatPack28-Flatpack, Ceramic Bottom-Brazed
Microchip Technology IC EEPROM 256K PARALLEL 28FLATPK ActiveNon-VolatileEEPROMEEPROM256Kb (32K x 8)
-
3ms90nsParallel4.5 V ~ 5.5 V-55°C ~ 125°C (TC)Surface Mount28-CFlatPack28-Flatpack, Ceramic Bottom-Brazed
Microchip Technology IC EEPROM 256K PARALLEL 28CPGA ActiveNon-VolatileEEPROMEEPROM256Kb (32K x 8)
-
10ms150nsParallel4.5 V ~ 5.5 V-55°C ~ 125°C (TC)
-
-
-
Microchip Technology IC EEPROM 256K PARALLEL 28CDIP ActiveNon-VolatileEEPROMEEPROM256Kb (32K x 8)
-
10ms200nsParallel4.5 V ~ 5.5 V-55°C ~ 125°C (TC)Through Hole28-CDIP (0.600", 15.24mm)28-CDIP
Microchip Technology IC EEPROM 256K PARALLEL 28CDIP ActiveNon-VolatileEEPROMEEPROM256Kb (32K x 8)
-
10ms150nsParallel4.5 V ~ 5.5 V-55°C ~ 125°C (TC)Through Hole28-CDIP (0.600", 15.24mm)28-CDIP
Microchip Technology IC EEPROM 256K PARALLEL 28CDIP ActiveNon-VolatileEEPROMEEPROM256Kb (32K x 8)
-
10ms200nsParallel4.5 V ~ 5.5 V-55°C ~ 125°C (TC)Through Hole28-CDIP (0.600", 15.24mm)28-CDIP